學術活動
國內專業學會事務 (Activities in domestic professional societies)
  1. 理事長： 台灣化學工程學會, 2018/12~2020/12
  2. 副理事長： 中國材料學會, 2018/2~2021/1
  3. (理)監事： 中國工程師學會新竹分會, 2010~迄今
  4. (常務)理事：中國材料學會, 2009~迄今
  5. 學術委員：中國材料學會學術委員會, 2009~2014
  6. 主任委員：台灣化學工程學會國際關係委員會, 2011/2~2011/8
  7. 常務理事：台灣化學工程學會, 2005, 2007~2010
  8. 理事：台灣化學工程學會, 2004~2010
  9. 評選委員： 十大傑出工程師, 中國工程師學會, 2007~2010
  10. 主任委員：學術委員會, 中國化學工程學會, 2003/2~ 2005/12
  11. 主任委員：會刊及叢書委員會, 中國化學工程學會, 2003 /2~ 2005/12
  12. 評選委員：優秀青年工程師, 中國工程師學會, 1999~2002
  13. 副秘書長：中國材料學會, 1999~2002
國際專業學會與國外大學事務
(Activities in the international professional societies and foreign universities)
  1. Committee Member：Alloy Phase Diagram Committee, ASM, 2006/8~now
  2. Council Member：EMPMD, TMS, 2004/3~now
  3. Chairperson：Alloy Phase Committee, TMS, 2004/3~ 2006/2; 2014/3~now
  4. Advisor：JOM, TMS, 2004/3~2008/3
  5. Chairperson：The GRE Asia Advisory Council, 2013
  6. External Expert：EU COST Action MP0602, "Advanced Solder Materials for High Temperature Application", Brno, Czek, June 2011
  7. Visiting Professor：(Lecturer of the Phase Equilibria of Materials course): Materials Science and Engineering Department, University of Wisconsin-Madison, Madison, WI, USA, 2007/8~ 2007/12
  8. Invited Professor：Laboratoire Genie des materiaux, Ecole Polytechnique de l'universite de Nantes, Nantes, France, 2002/6~ 2002/7
  9. Visiting Scholar：Materials Science and Engineering Department, Lehigh University, Bethlehem, PA, USA, 2000/6~ 2000/8
編輯任務(Editorial duties)
  1. Editorial committee member：Journal of Phase Equilibria and Diffusion, 2010/1~now
  2. Associate editor：Journal of Electronic Materials, 2006/8 ~now
  3. Editorial board member：Advances in Materials Research [ISSN: 2234-0912(Print), ISSN: 2234-179X(Online)], 2012/1~ 2014/12
  4. Editorial board member：Progress in Natural Science: Materials International, 2011/1~ 2014/12
  5. Editorial committee member：Journal of Engineering (National Chung Hsing University), 2010/1~2014/12
  6. Editorial board member：Nanoscience and Nanotechnology Letters, 2009/3~ 2011/12
  7. Editorial board member (編輯委員) ：化工(Chemical Engineering), 台灣化學工程學會, 2006/2~2011/1.
  8. Guest editor：Journal of Electronic Materials, 2003/11, 2006/1, 2006/11, 2007/11
  9. Editor-in-Chief (總編輯) ：化工(Chemical Engineering), 中國化學工程學會, 2003/2~ 2006/1
  10. Regional editor：Facets, IUMRS, 2000/11~2006/12
  11. Guest editor (主編)：材料會訊(Materials Science Bulletin), 中國材料科學學會, 1999/6
  12. Guest editor (主編)：電子資訊(Electronics Spectrum), EDMA and SID, 1996/9
國際邀請演講(International invited talks)
  1. "相圖與電子軟銲及熱電- 兼談台灣高等教育", 蘭州大學，蘭州、中國，August 18, 2017 (Invited Lecture).
  2. "相圖計算、缺陷模型與熱電性質", 發表於「第十屆海峽兩岸化學工程學術研討會」，銀川，中國。(Invited speech)
  3. "Phase equilibria studies of thermoelectric materials", presented at the 2017 APAM Sendai International Conference, Sendai, Japan. (Invited speech)
  4. “Interfacial reactions at the joints in the Bi2Te3-based thermoelectric modules“ (Invited speech), presented at the 146th TMS annual meeting, San Diego, USA. (Invited speech)
  5. S.-W. Chen, J.-C. Wang and L.-C. Chen, 2017, “Interfacial reactions at the joints of PbTe thermoelectric modules“, presented at the 146th TMS annual meeting, San Diego, USA. (Invited speech)
  6. "Phase diagrams and applications: Electronic soldering and Thermoelectrics", University of Illinois- Urbana Champaign, Urbana, Illinois, USA, 2016 (Invited Lecture).
  7. "相圖與電子軟銲及熱電- 兼談台灣高等教育", 西安交通大學，西安、中國，April 9, 2016 (Invited Lecture).
  8. "相圖與電子軟銲及熱電- 兼談台灣高等教育", 西北工業大學，西安、中國，April 5, 2016 (Invited Lecture).
  9. "相圖與電子軟銲及熱電- 兼談台灣高等教育", 山東大學，濟南、中國，April 1, 2016 (Invited Lecture).
  10. "Interfacial Reactions in the Ni/Ag-Sb and Ni/Ag-Ge Couples", presented at the 145th TMS annual meeting, Nashiville, Tennessee, USA, Februay 2016, (Inivted speech).
  11. "Interfacial Reactions in Thermoelectric Devices", Presented at the 144th TMS 2015 annual meeting, Orlando, Florida, USA, March 2015 (Invited speech).
  12. "Phase Equilibria of Cu-In-Se Ternary System ", Presented at the 144th TMS 2015 annual meeting, Orlando, Florida, USA, March 2015 (Invited speech).
  13. "Phase diagrams of thermoelectric Co-Sb-In ternary system", Presented at the 2014 IUMRS-ICEM, Taipei, Taiwan, June 2014 (Invited speech).
  14. "Phase equilibria of thermoelectric materials: Ag-Sb-Te and AgSbTe2-AgSbSe2", Presented at CALPHD XLIII meeting, Chang Sha, China, June 2014 (Invited speech)
  15. "CoSb3-InSb Isoplethal Section of Co-Sb-In Ternary Phase Diagram", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
  16. "Interfacial Reactions of Sn with the n-Type Bi2(Te,Se)3 and p-Type (Bi,Sb)2Te3 Thermoelectric Materials", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
  17. "Ag Whisker Growth of Ag-In-Se Alloys and Alternating Layer Formation in the In/Ag2Se Reaction Couples", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
  18. "Electronic soldering and thermoelectric materials: Phase diagrams and microstructures", Presented at the COST-Materials in a resource-constrained world conference, Deft University, November 19, 2013. (Invited speech)
  19. "相圖在電子軟銲上之應用", Presented at the 「海峽兩岸先進半導體封裝材料發展趨勢研討會」, 廈門、中國，June 14, 2013. (Invited Lecture)
  20. "相圖與應用:熱電與電子軟銲", Presented at the 「海峽兩岸三地新材料高端論壇」, 天津、中國，June 17, 2013. (Invited Lecture)
  21. "Reaction evolution and alternating layer formation in Sn/(Bi1-xSbx)2Te3 couples", Presented at the the 142nd TMS annual meeting, San Antonio, TX, USA, March, 2013. (Invited speech)
  22. "Interfacial reactions in the Sn-20wt%In-xwt%(Ag, or Zn)/(Cu, or Ni) couples", Presented at the Visual-JW 2012 (The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation) meeting, Osaka, Japan, November, 2012. (Keynote Speech)
  23. "Phase diagrams and applications: in electronic soldering and thermoelectric materials", UCLA, Los Angeles, USA, 2012.
  24. "Phase diagrams and applications: in electronic soldering and thermoelectric materials", Univesity of Michigan, Ann Arbor, USA, 2012.
  25. "Directional solidification and liquidus projection of Sn-Co-Cu system", Presented at the 141st TMS annual meeting, Orlando, FL, USA, March, 2012. (Invited speeh)
  26. "CALPHAD method and its application to lead-free solder materials", Presented at the 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei, September 2011. (Invited speeh)
  27. "Isothermal section and liquidus projection of the Sn-Zn-Ni ternary system", Presented at the 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei, September 2011. (Invited speeh)
  28. "Electromigration effects upon electronic solder joints", Harbin Institute of Technology, Harbin, China, 2011.
  29. "Electromigration effects upon electronic solder joints", Xiangtan University, Xiangtan, China, 2011.
  30. "Phase diagrams and their applications in electronic solder joints", Central South University, Changsha, China, 2011.
  31. "Interfacial reactions in the Sn-(Pb)/Ni-7wt%V couples", Presented at the 140th TMS annual meeting, San Diego, CA, USA, October 2010. (Invited speeh)
  32. "Sn-In-Ag phase equilibria and Sn-In/Ag Interfacial reactions", Presented at the Materials Science and Technology 2010 Meeting, Pittsburgh, PA, USA, October 2010. (Invited speeh)
  33. "Unusual Phenomena Observed in Soldering: Understanding Through Thermodynamics", Presented at the Materials Science and Technology 2010 Meeting, Pittsburgh, PA, USA, October 2010. (Invited speeh)
  34. “Interfacial reactions in the Sn-Co/Ni and Sn-Co-Cu/Ni couples", Presented at the 139th TMS annual meeting, SeattleWA, USA, February 2010. (Invited speeh)
  35. "Phase diagrams and their applications in electronic soldering", Presented at the Japan-Taiwan Joint Symposium on New Functional Materials and Their Nano- scale Analysis, Kyoto University, Kyoto, Japan, November 2009. (Invited speeh)
  36. "Interfacial reactions in the Solder/Ni-7wt%V alloy couples", Presented at the Materials Science and Technology 2009 Meeting, Pittsburgh, PA, USA, 2009. (Invited speeh)
  37. "Phase diagrams and their applications in electronic packaging", Department of Materials Science and Engineering, Tsinghua University, Beijing, China, 2009.
  38. “Interesting Phenomena Observed in The Sn/Co Interfacial Reactions”, Presented at the 138th TMS Annual Meeting, San Francisco, CA, USA, 2009. (Invited speeh)
  39. "Solidification of Sn-Bi-Ag and Sn-Bi-Ni alloys", Presented at the Materials Science and Technology 2008 Meeting, Pittsburgh, PA, USA, 2008. (Invited speeh)
  40. "Sn/Co Interfacial Reactions", Presented at the 137th TMS Annual Meeting, New Orleans, LA, USA, 2008. (Invited speeh)
  41. "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA, 2007.
  42. "Determinations of solidification curves of aluminum alloys - and some other things I learned from Alcoa", Alcoa Research Center, Alcoa center, PA, USA, 2007.
  43. "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, 2007.
  44. "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Michigan State University, East Lansing, MI, USA, 2007.
  45. "Electronic soldering-Pb-free solders and Interfacial reactions", ThermoFisher Scientific, Brookfield, WI, USA, 2007.
  46. "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, 2007.
  47. “Interfacial Reactions and Phase diagrams of Pb-Free Solders and Related Materials Systems,” presented at the Symposium on Phase Stability and Defect Structures in Advanced Materials: in honoring Professor Austin Chang, Distinguished Professor at University of Wisconsin, Crown Plaza Orlando Resort, Orlando, FL, USA, 2007. (Invited speeh)
  48. “Unusual interfacial reactions in the Sn/Ni-7wt.%V and Sn/Te couples”, Presented at the 136th TMS Annual Meeting,Orlando, FL, USA, 2007. (Invited speeh)
  49. "Electric Current Effects upon Interfacial Reactions in the Solder Joints", Department of Materials Science and Engineering, Beijing University of Technology, Beijing, China, 2006.
  50. "Electromigration effects upon interfacial reactions in teh Pb-free solder joints", Presented at the 2006 International Conference on Chemical and Molecular Technologies, Tainan, Taiwan, 2006. (Invited speeh)
  51. "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution", Presented at the 135th TMS Annual Meeting, San Antonio, TX, USA, 2006. (Invited speeh)
  52. "Phase Equilibria of the In-Sn-Cu System and the In-Sn/Cu Interfacial Reactions", Presented at Materials Science and Technology 2005 Meeting, Pittsburgh, PA, USA, 2005. (Invited speeh)
  53. "Phase equilibria and interfacial reactions of Pb-free solders/UBM systems", Department of Materials Science and Engineering, KAIST, Daejeon, Korea, 2005.
  54. "Electric current effects upon interfacial reactions in the solder joints", Presented at the SEMICON Korea 2005, Seoul, Korea, 2005.(Invited speeh)
  55. "Phase equilibria and interfacial reactions in the indium composite solder related materials systems", School of Materials Science and Engineering, Seoul National University, Seoul, Korea, 2005.
  56. "Electric current effects upon interfacial reactions in the solder joints", Samsung Electronics, Gyeonggi-Do, Korea, 2005.
  57. “Solidification of the quaternary Sn-Ag-Cu-Ni alloys”, Presented at the Materials Science and Technology 2004 Meeting, New Orleans, LA, USA, 2004. (Invited speeh)
  58. “Electromigration effects upon the Pb-free solder/Nickel interfacial reactions in the electronic products”, Presented at the Second 21stCentury COE, “Towards Creating New Industries Based on Inter-Nanoscience”, and 7th Sanken International Symposium on Hybridization of Chemistry, Biology and Materials Science, Osaka, Japan, 2004. (Invited speeh)
  59. ”Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints”, Presented at the 132nd TMS Annual Meeting, San Diego, CA, USA, 2003. (Invited speeh)
  60. “Phase equilibria and solidification properties of Sn-Cu-Ni alloys”, Presented at the 131st TMS Annual Meeting, Seattle, WA, USA, 2002.(Invited speeh)
  61. “Phase transformations and interfacial reactions in electronic materials”, Presented at the 2001 ChemTech Conference, Chicago, IL, USA, 2001. (Invited speeh)
  62. “Interfacial reactions in the Ag-Sn/Au couples”, Presented at the 130th TMS Annual Meeting, New Orleans, LA, USA, 2001. (Invited speeh)
  63. “Interfacial Reactions in the Ag-Sn/Cu Couples”, Presented at the 128th TMS Annual Meeting, San Diego, CA, USA, 1999. (Invited speeh)
  64. "Determination of Solidification Curves of Alloys", Presented at the Australasia Pacific Forum on Intelligent Processing & Manufacturing of Materials, Brisbane, Australia, 1997. (Invited speeh)
國際學術會議議程籌委與議程主席
(Symposium organizer and session chair of international meetings)
  1. Session Chair: 131st TMS Annual Meeting~ 146rd TMS Annual Meeting (2002~2017); Materials Science and Technology Meeting (2010, 2008, 2005, 2004), 2001 TMS Fall Meeting, 2001 (2001); "Materials Modeling, Simulation, and Characterizations symposium", 12th Annual Meeting of International Union of Materials Research Societies (IUMRS)- International Conference in Asia (ICA), Taipei, 2012; Visual-JW 2012, Osaka, Japan, November, 2012.
  2. Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium V”, The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, 2017.
  3. Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium IV”, The Minerals, Metals & Materials Society 2016 Annual Meeting, Nashville, Tenn., 2016.
  4. Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium III”, The Minerals, Metals & Materials Society 2015 Annual Meeting, Orlando, FL, 2015.
  5. Symposium Organizer: “Group E: Modeling, Processing and Characterization”, International Union of Materials Research Societies – International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan, 2014.
  6. Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium II”, The Minerals, Metals & Materials Society 2014 Annual Meeting, San Diego, CA, 2014.
  7. Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium”, The Minerals, Metals & Materials Society 2013 Annual Meeting, San Antonio, TX, 2013.
  8. Advisory Committee Member: Visual-JW 2012 (The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation) meeting, Osaka, Japan, November, 2012.
  9. Symposium Organizer: "Materials Modeling, Simulation, and Characterizations symposium", 12th Annual Meeting of International Union of Materials Research Societies (IUMRS)- International Conference in Asia (ICA) , Taipei, 2012.
  10. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials X Symposium”, The Minerals, Metals & Materials Society 2011 Annual Meeting , San Diego, CA, 2011.
  11. Symposium Organizer: “Lead-free Solders and Next Generation Interconnects: Emerging Issues in Manufacturing”, Materials Science and Technology 2010 Meeting , Houston, TX, 2010.
  12. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium”,The Minerals, Metals & Materials Society 2010 Annual Meeting, Seattle, WA, 2010.
  13. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VIII Symposium”, The Minerals, Metals & Materials Society 2009 Annual Meeting , San Francisco, CA, 2009.
  14. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VII Symposium”, The Minerals, Metals & Materials Society 2008 Annual Meeting , New Orleans, LA, 2008.
  15. Symposium Organizer: “Hume-Rothery Symposium”, The Minerals, Metals & Materials Society 2008 Annual Meeting , New Orleans, LA, 2008.
  16. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VI Symposium”, The Minerals, Metals & Materials Society 2007 Annual Meeting , Orlando, FL, 2007.
  17. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials V Symposium”, The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, 2006.
  18. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium”, The Minerals, Metals & Materials Society 2005 Annual Meeting , San Francisco, CA, 2005.
  19. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III Symposium”, The Minerals, Metals & Materials Society 2004 Annual Meeting , Charlotte, NC, 2004.
  20. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium”, The Minerals, Metals & Materials Society 2003 Annual Meeting , San Diego, CA, 2003.
  21. Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium”, The Minerals, Metals & Materials Society 2002 Annual Meeting , Seattle, WA, 2002.
  22. Symposium Organizer: “Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for Electronic Packaging Symposium”, The Minerals, Metals & Materials Society 2001 Fall Meeting , Indianapolis, IN, 2001.