1. 2017

    2. W. Gierlotka, S.-W. Chen, S.-M.Tseng and P.-H. Lin, “Co-In-Sb ternary system (II): Isoplethal section and thermodynamic modeling”, submitted to a journal for publication (Grant NSC99-2221-E-007-093-MY3).
    3. *S.-W. Chen, Z.-W. Liu, H.-S. Chu and Z.-Y. Huang, “Interfacial reactions between Ni and Bi2(Se0.1Te0.9)3 and its constituent material systems”, submitted to a journal for publication, (NSC99-2221-E-007-093-MY3)
    4. *V. B. Rajkumar and *S.-W. Chen, “Phase equilibria and thermodynamic descriptions of Ag-Ge and Ag-Ge-Ni systems”, submitted to a journal for publication, (MOST 104-281-E-007-054).
    5. *S.-W. Chen, W.-T. Chiu, W. Gierlotka, J.-S. Chang and C.-H. Wang, 2017, “Liquidus projection and thermodynamic modeling of Sn-Ag-Zn system”, Journal of Electronic Materials, (accepted for publication) (MOST 97-2221-E-007-067-MY3 and 105-2221-E-259-004).
    6. *S.-W. Chen, J.-S. Chang, and L.-C. Chang, 2017, “Liquidus projection and isothermal section of Sb-Se-Te ternary system”, Materials Chemistry and Physics, (accepted for publication). (MOST 99-2221-E-007-093-MY3).
    7. J.-S. Chang and *S.-W. Chen, 2017, “Liquidus projection and isothermal section of the Sb-Se-Sn system”, Metallurgical and Materials Transactions E: Materials for Energy Systems, Vol. 4(2), pp. 89-100. (MOST 103-2923-E-007-002-MY2).
    8. *S.-W. Chen and S.-T. Lu, 2017, “Bi-In-Te phase diagrams”, Journal of Alloys and Compounds, Vol. 722, pp. 499-508, (MOST 104-2221-E-007 -090 -MY3).
    9. V. B. Rajkumar and *S.-W. Chen, 2017, “Thermodynamic modelling of Ag-Ni system combining experiments and molecular dynamic simulation”, Journal of Electronic Materials, Vol. 46(4), pp. 2282-2289 (MOST104–2811–E–007–054).
    10. *S.-W. Chen, A. H. Chu and D. S.-H. Wong, 2017, “Interfacial reactions at the joints of CoSb3-based thermoelectric devices”, Journal of Alloys and Compounds, Vol. 699, pp. 448-454 (MOST 103-2221-E-007 -021 -MY3).
    11. *S.-W. Chen, J.-C. Wang and L.-C. Chen, 2017, “Interfacial reactions at the joints of PbTe thermoelectric modules using Ag-Ge braze”, Intermetallics, Vol. 83, pp. 55-63, (MOST 103-2221-E-007 -021 -MY3).
    12. *S.-W. Chen, L.-C. Chen and J.-C. Wang, 2017, “Ag-Ni-Sb phase equilibria and Ag-Sb/Ni interfacial reactions”, Journal of Alloys and Compounds, Vol. 694, pp. 93–102, (MOST 103-2221-E-007 -021 -MY3).
    13. 2016

    14. *S.-W. Chen, H.-J. Wu and J.-S. Chang, 2016, "Thermoelectric materials and thermoelectric modules”, Chemical Engineering, Vol. 63(5), pp.75-92.
    15. P.-H. Lin, *S.-W. Chen, J.-D. Hwang and H.-S. Chu, 2016, “Liquidus projections of Bi-Se-Ga and Bi-Se-Te ternary systems”, Metallurgical and Materials Transactions E: Materials for Energy Systems, Vol. 3(4), pp. 281-290. (NSC103-2923-E-007-002-MY2).
    16. *S.-W. Chen, T.-R. Yang, C.-Y. Wu, H.-W. Hsiao, H.-S. Chu, J.-D. Huang and T.-W. Liou, 2016,“Interfacial reactions inthe Ni/(Bi0.25Sb0.75)2Te3 andNi/Bi2(Te0.9Se0.1)3couples”, Journal of Alloys and Compounds, Vol. 686, pp. 847-853. (NSC99-2221-E-007-093-MY3).
    17. *S.-W. Chen, J.-W. Chen and P.-H. Lin, 2016 “Liquidus projection of Co-Sb-Yb ternary system”, Materials Letters, Vol. 182, pp. 36-38. (NSC96-2218-E-007-012).
    18. *S.-W. Chen, T.-R. Yang, H.-W. Hsiao, P.-H. Lin, J.-H. Huang and J.-D. Huang, 2016, “Ni/Te and Ni/Ag2Te interfacial reactions“, Materials Chemistry and Physics, Vol. 180, pp. 396-403. (NSC99-2221-E-007-093-MY3).
    19. J.-S. Chang and *S.-W. Chen, 2016, "Liquidus projection and isothermal section of the Pb-Sb-Se ternary system", Journal of Alloys and Compounds, Vol. 666, pp. 159-169. (NSC103-2923-E-007-002-MY2).
    20. *S.-W. Chen, J.-S. Chang, S.-M. Tseng, L.-C. Chang, and J.-Y. Lin, 2016, "Phase diagrams of the Ag-In-Se photovoltaic material system", Journal of Alloys and Compounds, Vol. 656, pp. 58-66. (NSC 100-2221-E-007-087-MY3).
    21. 2015

    22. S.-M. Tseng, *S.-W. Chen, J.-S. Chang, Y. Tang and G. J. Snyder, 2015, “Co-In-Sb ternary system (I): Isothermal sections and liquidus projection”, Metallurgical and Materials Transactions E: Materials for Energy Systems, Vol. 2(4), pp. 236-249. (NSC103-3113-P-008-001)
    23. *H.-J. Wu, P.-C. Lee, F.-Y. Chiu, S.-W. Chen and Y.-Y. Chen, 2015, "Self-assisted nucleation and growth of [010]-oriented Sb2Se3 whisker: the crystal structure and thermoelectric property", Journal of Materials Chemistry C, Vol. 3(40), pp. 10488-10493. (NSC103-2218-E-110-007-MY2).
    24. W.-T Chiu, *S.-W. Chen and S.-M. Tseng, 2015, "Liquidus projection of Cu-In-Se photovoltaic material system", Solar Energy Materials and Solar Cells, Vol. 141, pp.187–193.(NSC97-2221-E-007-067-MY3).
    25. *S.-W. Chen, J.-S. Chang, C.-M. Hsu, J.-Y. Lin, and C.-H. Wang, 2015, "Interfacial reactions in In/Ag2Se couples", Materials Chemistry and Physics, Vol. 162 , pp. 11-14. (NSC97-2221-E-007-067-MY3).
    26. Y. Tang, S.-W. Chen, G. J. *Snyder, 2015, "Temperature Dependent Solubility of Yb in Yb-CoSb3 Skutterudite and its Effect on Preparation, Optimization and Lifetime of Thermoelectrics", Journal of Materiomics, Vol. 1, pp. 75-84. (NSC101-3113-P-008-001)
    27. *S.-W. Chen, Y.-C. Chien, W.-A. Chen, J.-S. Chang and G. Snyder, 2015, "Liquidus projection and phase equilibria isothermal section of ternary Co-Sb-Ga system", Journal of Alloys and Compounds, Vol. 637, pp. 98-105. (NSC101-3113-P-008-001).
    28. Y. Tang, R. Hanus, S.-W. Chen, *G. J. Snyder, 2015, "Solubility Design Leading to High zT in Low-Cost Ce-CoSb3 Skutterudites", Nature Communications, Vol. 6, Article number: 7584 doi:10.1038/ncomms8584.
    29. H.-J. Wu, T.-W. Lan, *S.-W. Chen, Y.-Y. Chen, T. Day and G. J. Snyder, 2015, "State of the art Ag50-xSbxSe50-yTey alloys: their high zT values, microstructures and related phase equilibria", Acta Materialia, Vol. 93, pp. 38–45 (NSC97-2221-E-007-067-MY3).
    30. S. Bajaj, G. S. Pomrehn, J. W. Doak, W. Gierlotka, H.-J. Wu, S.-W. Chen, C. Wolverton, W.A. Goddard III, and *G. J. Snyder, 2015, "Ab initio study of intrinsic point defects in PbTe: an insight into phase stability", Acta Materialia, Vol. 92, pp. 72–80.
    31. W.-A. Chen, *S.-W. Chen, S.-M. Tseng, H.-W. Hsiao, Y.-Y. Chen, G. J. Snyder and Y. Tang, 2015, "Interfacial reactions in Ni/CoSb3 couples at 450oC", Journal of Alloys and Compounds, Vol. 632, pp. 500-504. (NSC102-3113-P-008-001)
    32. J.-S. Chang and *S.-W. Chen, 2015, "Liquidus projection and isothermal section of the Ag-In-Zn ternary system", Journal of Electronic Materials, Vol. 44(4), pp. 1134-1143. (NSC101-3113-P-008-001).
    33. W. Gierlotka, *S.-W. Chen, W.-A. Chen, J.-S. Chang, G. J. Snyder and Y. Tang, 2015, "The Co-Sb-Ga system: isoplethal section and thermodynamic modeling", Metallurgical and Materials Transactions A, Vol. 46A, pp.1488-1499. (NSC101-3113-P-008-001 and NSC102-2221-E-259 -034 )
    34. S.-K. Lin, R.-B. Chang, *S.-W. Chen, M-Y. Tsai, and C.-M. Hsu, 2015, "Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni substrates", Materials Chemistry and Physics, Vol. 154, pp. 60-65. (NSC97-2221-E-007-067-MY3).
    35. 2014

    36. *S.-W. Chen, C.-Y. Wu, H.-J. Wu, and W.-T. Chiu, 2014, "Interfacial reactions in Sn/Bi2Te3, Sn/Bi2Se3 and Sn/Bi2(Te1-xSex)3 couples", Journal of Alloys and Compounds, Vol. 611, pp. 313-318. (NSC99-2221-E-007-093-MY3).
    37. J.-S. Chang, *S.-W. Chen, K.-C. Chiu, H.-J. Wu and J.-J. Chen, 2014, "Liquidus projection of the Ag-Sn-Te ternary system", Metallurgical and Materials Transactions A, Vol. 45A, pp. 3728-3740. (NSC99-2221-E-093-MY3).
    38. *S.-W. Chen, T.-K. Chen, C.-M. Hsu, J.-S. Chang and K. Pan, 2014, "Liquidus projections of Sn-Co-Ni and Sn-rich Sn-Ag-Co-Ni systems", Journal of Electronic Materials, Vol. 43(7), pp. 2487-2497. (NSC96-2218-E-007-012).
    39. S.-K. Lin, R.-B. Chang, *S.-W. Chen, M.-Y. Tsai, and C.-M. Hsu, 2014, "Effects of zinc on the interfacial reactions of tin-indium solder joints with copper", Journal of Materials Science, Vol. 49, pp. 3805–3815. (NSC97-2221-E-007-067-MY3).
    40. Y. Tang, Y. Qiu, L. Xi, X. Shi, W. Zhang, L. Chen, S.-M. Tseng, S.-W. Chen, *G. J. Snyder, 2014, "Phase diagram of In-Co-Sb system and thermoelectric properties of In-containing skutterudites", Energy & Environmental Science, Vol. 7, pp. 812–819 (NSC101-3113-P-008-001).
    41. *S.-W. Chen, T.-K. Chen, J.-S. Chang, C.-M. Hsu and W.-A. Chen, 2014, "Interfacial reactions in Sn-Ag/Co couples", Journal of Electronic Materials, Vol. 43(2), pp. 636-639. (NSC 97-2221-E-007-067-MY3).
    42. *C.-H. Wang, W.-H. Lai and S.-W. Chen, 2014, "Dissolution and Interfacial Reactions of (Cu,Ni)6Sn5 Intermetallic Compound in Molten Sn-Cu-Ni Solders", Journal of Electronic Materials, Vol. 40(1), pp. 195-203.
    43. 2013

    44. *S.-W. Chen, C.-W. Hsu, S.-K. Lin and C.-M. Hsu, 2013, "Reaction evolution in Sn-20.0wt%In-2.8wt%Ag/Ni couples", Journal of Materials Research, Volume 28(23), pp 3257-3260. (NSC97-2221-E-007-067-MY3).
    45. *S.-W. Chen, J.-Y. Lin, C.-M. Hsu, J.-S. Chang, J.-G. Duh and C.-H. Wang, 2013, "Ag whisker formation in Ag-In-Se alloys", Metallurgical and Materials Transactions A, Vol. 44A, pp. 5281-5283. (NSC 100-2221-E-007-087-MY3)
    46. C.-H. Liu, H.-J. Wu, and *S.-W. Chen, 2013, "Liquidus projection of the ternary Bi-Sb-Te thermoelectric material system", Metallurgical and Materials Transactions A, (accepted for publication). (NSC99-2221-E-093-MY3).
    47. S.-K. Lin, C.-W. Hsu, *S.-W. Chen, and C.-M. Hsu, 2013, "Interfacial reactions in Sn-20wt.%In-2.8wt.%Ag/Cu couples", Journal of Electronic Materials, Vol. 142, pp. 268-275, (NSC97-2221-E-007-067-MY3).
    48. H.-J. Wu, W.-J. Foo, W. Gierlotka, *S.-W. Chen, G. J. Snyder, 2013, "Microstructure, liquidus projection and thermodynamic modeling of thermoelectric Ag-Pb-Te system", Materials Chemistry and Physics, Vol. 141, pp. 758-767 (NSC 99-2221-E-007-093-MY3 and 100-2221-E-155-019).
    49. C.-M. Hsu and *S.-W. Chen, 2013, "Sn-Co/Ag and Sn-Co/Cu interfacial reactions with/ without electromigration", Journal of Materials Science, Vol. 48(19), pp. 6640-6646. (NSC96-2218-E-007-012)
    50. Y. Qiu, L. Xi, X. Shi, P. Qiu, W. Zhang, L. Chen, J. R. Salvador, J. Y. Cho, J. Yang, Y-C. Chien, S.-W. Chen, Y. Tang and *G. J. Snyder, 2013, "Charge-Compensated Compound Defects in Ga-containing Thermoelectric Skutterudites", Advanced Functional Materials, Vol. 23, pp. 3194–3203. (NSC 101-3113-P-008-001).
    51. *S.-W. Chen, H.-J. Wu, C.-W. Hsu, C.-I Chang and C.-F. Chang, 2013, "Interfacial reactions in In/Cu2Se couples", Journal of the Taiwan Institute of Chemical Engineers, Vol. 44, pp. 402-406. (NSC 100-2221-E-007-087-MY3)
    52. *S.-W. Chen, J.-S. Chang, K. Pan, C.-M. Hsu and C.-W. Hsu, 2013, "Directional solidification and liquidus projection of Sn-Co-Cu system", Metallurgical and Materials Transactions A, Vol. 44A, pp. 1656-1664 (NSC96-2218-E-007-012).
    53. *S.-W. Chen, H.-J. Wu, C.-Y. Wu, C.-F. Chang and C.-Y. Chen, 2013, "Reaction evolution and alternating layer formation in Sn/(Bi0.25Sb0.75)2Te3 and Sn/Sb2Te3 couples", Journal of Alloys and Compounds, Vol. 553, pp. 106-112. (NSC97-2221-E-007-067-MY3)
    54. C.-Y. Chen, H.-J. Wu, and *S.-W. Chen, 2013, "Liquidus projection and phase equilibria isothermal section of Se-Sn-Te system", Journal of Alloys and Compounds, Vol. 547, pp. 100–106. (NSC99-2221-E-093-MY3).
    55. 2012

    56. T. Ikeda, S. Iwanaga, H.-J. Wu, N. J. Marolf, S.-W. Chen, *G. J. Snyder, 2012, "A combinatorial approach to microstructure and thermopower of bulk thermoelectric materials: the pseudo-ternary PbTe-Ag2Te-Sb2Te3 system", Journal of Materials Chemistry, Vol. 22, pp. 24335-24347.
    57. C.-M. Chen, C.-M. Hsu and *S.-W. Chen, 2012, "Interfacial reactions in Sn-Co-(Cu)/Ni couples with/without current stressing", Journal of Electronic Materials, Vol. 41, No. 11, pp. 3205-3214. (NSC96-2218-E-007-012)
    58. H.-J. Wu, *S.-W. Chen, T. Ikeda, *G. J. Snyder, 2012, "Reduced thermal conductivity in Pb-alloyed AgSbTe2 thermoelectric materials", Acta Materialia, Vol. 60, pp. 6144-6151. (NSC 99-2221-E-007-093-MY3 and NSC 100-2917-I-007-001)
    59. Y.-K. Chen, C.-M. Hsu, *S.-W. Chen, C.-M. Chen and Y.-C. Huang, 2012, "Phase equilibria of Sn-Co-Cu ternary system", Metallurgical and Materials Transactions A, Vol. 43(10), pp. 3586-3595. (NSC97-2221-E-007-067-MY3)
    60. H.-J. Wu, *G. J. Snyder, *S.-W. Chen, and W.-J. Foo, 2012, "Ternary eutectic growth of nanostructured thermoelectric Ag-Pb-Te materials", Applied Physics Letters, Vol. 101(2), 023107. (NSC 99-2221-E-007-093-MY3 and NSC100-2917-I-007-001)
    61. *S.-W. Chen, H.-J. Wu, C.-H. Liu, Y.-C. Chien and C.-C. Hu, 2012, "Dental arch wires with tooth-like color", Advances in Materials Research, Vol.1(1), pp. 31-35. (NSC96- 2218- E-007-012)
    62. H.-C. Chang, S. L. Chang, *C.-H. Lin, *S.-W. Chen, 2012, "Design and synthesis of unsymmetric phosphinated diamines for high-Tg transparent polyimides", Polymer, Vol. 5, pp. 1651-1658.
    63. *S.-W. Chen, C.-F. Yang, H.-J. Wu, R.-B. Chang and C.-M. Hsu, 2012, "Interfacial reactions in the Sn-In-Zn/Ag and Sn-In-Zn/Ni couples", Materials Chemistry and Physics, Vol. 132, pp. 481-487. (NSC97-2221-E-007-067-MY3)
    64. *S.-W. Chen, A.-R. Zi, W. Gierlotka, C.-F. Yang, C.-H. Wang and S.-K. Lin, 2012, "Phase equilibria of Sn-Sb-Cu system", Materials Chemistry and Physics, Vol. 132, pp. 703-715. (NSC95-2221-E-007-205).
    65. H.-J. Wu, *S.-W. Chen, T. Ikeda, G. J. Snyder, 2012, "Formation of ordered nano-wire microstructures in thermoelectric Pb-Ag-Sb-Te", Acta Materialia, Vol. 60, pp. 1129-1138. (NSC 99-2221-E-007-093-MY3 and NSC 100-2917-I-007-001)
    66. C.-N. Chiu, C.-M. Hsu, *S.-W. Chen and H.-J. Wu, 2012, "Phase equilibria of Sn-Bi-Te ternary system", Journal of Electronic Materials, Vol. 41(1), pp. 22-31. (NSC97-2221-E-007-067-MY3)
    67. 2011

    68. *S.-W. Chen, C.-M. Hsu, C.-Y. Chou and C.-W. Hsu, 2011, "Isothermal section of ternary Sn-Zn-Ni phase equilibria at 250C", Progress in Natural Science: Materials International, Vol. 21, pp. 386-391, (NSC 97-2221-E-007-067-MY3).
    69. *S.-W. Chen, Y.-R. Lin, H.-J. Wu, R.-B. Chang and H.-M. Lin, 2011, "Evolution of the Sn/Ni-8.0at%V interfacial reaction paths", Journal of Materials Research, Vol. 26(22), pp. 2838-2843. (NSC97-2221-E-007-067-MY3)
    70. H.-J. Wu and *S.-W. Chen, 2011, "Phase equilibria of Ag-Sb-Te thermoelectric materials", Acta Materialia, Vol. 59, pp. 6463–6472. (NSC97-2221-E-007-067-MY3).
    71. *S.-W. Chen, W.-Y. Lee, C.-M. Hsu, C.-F. Yang, H.-Y. Hsu and H.-J. Wu, 2011, "Sn-In-Ag phase equilibria and Sn-In-(Ag)/Ag Interfacial reactions", Materials Chemistry and Physics, Vol. 128(3), pp. 357-364. (NSC97-2221-E-007-067-MY3).
    72. *S.-W. Chen, Y.-R. Lin, H.-J. Wu and R.-B. Chang, 2011, "Interfacial reactions in the Sn-Pb/Ni-8.0at%V couples", Journal of Electronic Materials, Vol. 40(7), pp.1527-1532. (NSC97-2221-E-007-067-MY3).
    73. C.-P. Lin, C.-M. Chen*, Y.-W. Yen, H.-J. Wu, S.-W. Chen, 2011, “Interfacial reactions between high-Pb solders and Ag”, Journal of Alloys and Compounds, Vol. 509, pp. 3509-3514. (NSC 96-2221-E-005-064-MY3)
    74. H.-J. Wu and *S.-W. Chen, 2011, "Microstructures and liquidus projection of the ternary Ag-Sb-Te system", Journal of Alloys and Compounds, Vol. 509, pp. 656-668. (NSC97-2221-E-007-067-MY3).
    75. S.-J Cherng, *C.-M. Chen, W.-P. Dow, C.-H. Lin and S.-W. Chen, 2011, "Chemical Deposition of Ni/Pt Bi-Layer on Polyimide Film as Flexible Counter electrodes for Dye-Sensitized Solar Cells", Electrochemical and Solid-State Letters, Vol. 14 (7), pp. 13-15.
    76. Y.-C. Huang and *S.-W. Chen, 2011, "Effects of Co alloying and size on solidification and interfacial reactions in the Sn-57wt%Bi-(Co)/Cu couples", Journal of Electronic Materials, Vol. 40(1), pp. 62-70. (NSC97-2221-E-007-067-MY3)
    77. *C.-H. Wang, C.-Y. Kuo, H.-H. Chen and S.-W. Chen, 2011, "Effects of current density and temperature on Sn/Ni interfacial reactions under current stressing", Intermetallics, Vol. 19, pp. 75-80. (#NSC97-2218-E-194-006).
    78. 2010

    79. Y.-C. Huang and *S.-W. Chen, 2010, "Co alloying and size effects on solidification and interfacial reactions in the Sn-Zn-(Co)/Cu couples", Journal of Materials Research, Vol. 25(12), pp. 2430-2438. (NSC97-2221-E-007-067-MY3)
    80. *S.-W. Chen, Y.-K. Chen, H.-J. Wu, Y.-C. Huang and C.-M. Chen, 2010, "Co solubility in Sn and Interfacial reaction in Sn-Co/Ni couples", Journal of Electronic Materials, Vol. 39(11) pp. 2418-2428. (NSC97-2221-E-007-067-MY3).
    81. *S.-W. Chen, H.-J. Wu, Y.-C. Huang and W. Gierlotka, 2010, "Phase equilibria and solidification of ternary Sn-Bi-Ag alloys", Journal of Alloys and Compounds, Vol. 497(1-2), pp.110-117. (NSC96-221-E-007-001).
    82. S.-H. Wang, *T.-S. Chin, C.-F. Yang, S.-W. Chen, C.-T. Chuang, 2010, "Pb-free solder alloy based on Sn-Zn-Bi with the addition of Germanium", Journal of Alloys and Compounds, Vol. 497(1-2), pp. 428-431.
    83. Y.-C. Huang, W. Gierlotka, and *S.-W. Chen, 2010, "Sn-Bi-Fe thermodynamic modeling and Sn-Bi/Fe interfacial reactions", Intermetallics, Vol. 18, pp. 984-991. (NSC96-2221-E-007-001).
    84. C.-H. Wang, C.-N. Chiu and *S.-W. Chen, 2010, "Investigations on the interfacial reactions at the reentrant corners", Journal of Materials Research, Vol. 25(5), pp. 999-1003. (NSC 97-2221-E-007 -067 -MY3).
    85. *W.-P. Dow, G.-L. Liao, S.-E. Huang and S.-W. Chen, 2010, "Modification of Cu Nanoparticles with a Disulfide for Polyimide Metallization", Journal of Materials Chemistry, Vol. 20, pp. 3600-3609. (NSC 96-2218-E-007-012).
    86. C.-F. Yang and *S.-W. Chen, 2010, "Interfacial Reactions in Au/Sn/Cu Sandwich Specimens", Intermetallics, Vol. 18, pp. 672-678. (NSC96-2218-E-007-012).
    87. Y.-C. Huang, *S.-W. Chen and K.-S. Wu, 2010, "Size and substrate effects upon undercooling of Pb-free solders", Journal of Electronic Materials, Vol. 39(1), pp. 109-114. (NSC97-2221-E-007-067-MY3).
    88. 2009

    89. *S.-L. Chen, Y. Yang, S.-W. Chen, X.-G. Lu, Y. A. Chang, 2009, "Solidification Simulation Using Scheil Model in Multicomponent Systems", Journal of Phase Equilibria and Diffusion, Vol. 30, pp. 429-434.
    90. H.-J. Wu, L.-L. Huang, *S.-W. Chen, E. J.-W. Liou and Y.-T. Lee, 2009, "Surface characterization of anodized dental archwires and miniscrews", Journal of the Taiwan Institute of Chemical Engineers, Vol. 40, pp. 563-572. (NSC96-2221-E-007-001)
    91. S.-K. Lin, T.Y. Chung, *S.-W. Chen, C.-H. Chang, 2009, "250oC isothermal section of ternary Sn-In-Cu phase equilibria", Journal of Materials Research, Vol. 24(8), pp. 2628-2637. (NSC 97-2218-E-007-002).
    92. Y.-C. Huang, *S.-W. Chen, C.-Y. Chou, W. Gierlotka, 2009, "Liquidus projection and thermodynamic modeling of Sn-Zn-Cu ternary system", Journal of Alloys and Compounds, Vol. 477(1-2), pp. 283-290. (NSC94-2214-E-007-006)
    93. *W. Gierlotka, P. Jarosz and S.-W. Chen, 2009, "Liquid phase vapor pressure measurement and thermodynamics assessment of the Hg-In binary system", Thermochimica Acta, Vol. 491, pp. 29-34. (NSC 96-2221-E-007-001).
    94. *C.-C. Hu, Y.-D. Tsai, C.-C. Lin, G.-L. Lee, S.-W. Chen, T.-C. Lee and T.-C. Wen, 2009, "Anomalous growth of whisker-like bismuth–tin extrusions from tin-enriched tin–Bi deposits", Journal of Alloys and Compounds, Vol. 472, pp. 121-126. (NSC 96-2628-E-007-146-MY2)
    95. C.-H. Wang and *S.-W. Chen, 2009, "The Peltier effect upon Sn/Co interfacial reactions", Journal of Electronic Materials, Vol. 38(5), pp. 655-662. (NSC 96-2221-E-007 -001)
    96. *陳信文、黃莉玲、吳欣潔、劉人文、李岳澤、葉銘泉,2009,"牙齒矯正線磨擦力",化工,Vol. 56(1), pp. 92-106. (NSC96-2218-E-007-012).
    97. 2008

    98. C.-N. Chiu, C.-H. Wang and *S.-W. Chen, 2008, “Interfacial reactions in the Sn-Bi/Te couples”, Journal of Electronic Materials, Vol. 37(1), pp. 40-44. (NSC95-2218-E-007-028)
    99. W. Gierlotka and *S.-W. Chen, 2008, "Thermodynamic descriptions of the Cu-Zn system", Journal of Materials Research, Vol. 23(1), pp. 258-263. (NSC95-2221-E-007-205)
    100. Y.-H. Chao, *S.-W. Chen, C.-H. Chang and C.-C. Chen, 2008, "Phase equilibria of Sn-Co-Ni system and interfacial reactions in Sn/(Co, Ni) couples", Metallurgical and Materials Transactions A, Vol. 39(3), pp. 477-489. (NSC95-2221-E-007-205)
    101. S.-K. Lin, C.-F. Yang, S.-H. Wu, and *S.-W Chen, 2008, "Liquidus projection and solidification of the Sn-In-Cu ternary alloys", Journal of Electronic Materials, Vol. 37(4), pp. 498-506. (NSC 96-2221-E-007 -001)
    102. C.-C. Chen, *S.-W. Chen and C.-H. Chang, 2008, “Electromigration effects upon the Sn/Ni-7wt.%V interfacial reactions”, Journal of Applied Physics, Vol. 103(6), 063518. (NSC95-2218-E007-028)
    103. C.-H. Wang and *S.-W. Chen, 2008 "Interfacial reactions in Sn-(Cu)/Cu6Sn5/Ni couples at 210oC", Intermetallics, Vol. 16, pp. 531-537. (NSC95-2221-E-007-205)
    104. C.-C. Wang and *S.-W. Chen, 2008, "Sn/Co solid/solid interfacial reactions", Intermetallics, Vol. 16, pp. 524-530. (NSC96-2221-E-007 -001)
    105. *S.-W. Chen, C.-C. Chen, W. Gierlotka, A.-R. Zi, P.-Y. Chen and H.-J. Wu, 2008, "Phase equilibria of the Sn-Sb binary system", Journal of Electronic Materials, Vol. 37(7), pp. 992-1002. (NSC95-2218-E007-028)
    106. C.-C. Chen, *S.-W. Chen and C.-H. Chang, 2008, "Solid/solid Interfacial Reactions between Sn-0.7wt.%Cu and Ni-7wt.%V", Journal of Materials Research, Vol. 23(7), pp. 1895-1901. (NSC NSC93-2216-E007-043)
    107. *S.-W. Chen, A.-R. Zi, P.-Y. Chen, H.-J. Wu, Y.-K. Chen and C.-H. Wang, 2008, "Interfacial reactions in the Sn-Sb/Ag and Sn-Sb/Cu couples", Materials Chemistry and Physics, Vol. 111(1), pp. 17-19. (NSC95-2218-E007-028)
    108. C.-F. Yang, F.-L. Chen, W. Gierlotka, *S.-W. Chen, K.-C. Hsieh, L.-L. Huang, 2008, "Thermodynamic properties and phase equilibria of Sn-Bi-Zn ternary alloys", Materials Chemistry and Physics, Vol. 112(1), pp. 94-103. (NSC 95-2218-E-007-028)
    109. C.-C. Chen, W. Gierlotka and *S.-W. Chen, 2008, "Phase Equilibria of Sn-V System and Interfacial Reactions in Sn/V couples", Journal of Electronic Materials, Vol. 37(11), pp. 1727-1733. (NSC95-2218-E007-028)
    110. *C.-C. Chen, S.-W. Chen and C.-H. Chang, 2008, "Characterizations of the Ternary Phase Formed at the Sn/Ni-V joint", Journal of Materials Research, Vol. 23(10), pp. 2743-2748. (NSC95-2218-E007-028)
    111. *S.-W. Chen, P.-Y. Chen, C.-N. Chiu, Y.-C. Huang and C.-H. Wang, 2008, "Phase equilibria of Sn-Sb-Ag ternary system (I): Experimental", Metallurgical and Materials Transactions A, Vol. 39A, pp. 3191-3198. (NSC96-2221-E-007-001)
    112. W. Gierlotka, Y.-C. Huang and *S.-W. Chen, 2008, "Phase equilibria of Sn-Sb-Ag ternary system (II): Calculation", Metallurgical and Materials Transactions A, Vol. 39A, pp. 3199-3209. (NSC96-2221-E-007-001)
    113. 王朝弘、李佑翔、陳信文,2008,"磁場對電子產品中銲點界面反應之影響",化工,第55卷第5期,pp. 63-72。
    114. 2007

    115. *S.-W. Chen and C.-N. Chiu, 2007, "Unusual cruciform pattern interfacial reactions in the Sn/Te couples", Scripta Materialia, Vol. 56(2), pp. 97-99, (NSC94-2216-E007-047).
    116. *S.-W. Chen, C.-H. Wang, S.-K. Lin and C.-N. Chiu, 2007, "Phase Diagrams of Pb-Free Solders and their Related Materials Systems”, Journal of Materials Science: Materials in Electronics, (invited review), Vol. 18, pp. 19-37. (NSC94-2214-E-007-006)
    117. *S.-W. Chen, C.-H. Wang, S.-K. Lin, C.-N. Chiu and C.-C. Chen, 2007, "Phase transformation and microstructural evolution in the solder joints", JOM, Vol. 59(1), pp. 41-45. (NSC94-2214-E-007-006)
    118. *S.-W. Chen, C.-C. Chen and C.-H. Chang, 2007, "Interfacial Reactions in Sn/Ni-7wt.%V Couple", Scripta Materialia, Vol. 56(6), pp.453-456, (NSC94-2216-E007-047).
    119. *S.-W. Chen and C.-H. Wang, 2007, "Effects of electromigration on interfacial reactions in cast Sn/Cu joints", Journal of Materials Research, Vol. 22(3), pp. 695-702, (NSC94-2216-E-007-047)
    120. *S.-W. Chen, C.-N. Chiu and K.-C. Hsieh, 2007, "Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the 210oC", Journal of Electronic Materials, Vol. 36(3), pp. 197-206. (NSC 93-2214-E-007-001)
    121. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M. Tsujimoto and I. Yanada, 2007, "Mechanical deformation-induced Sn whiskers growth on electroplated films in the advanced flexible electronic packaging", Journal of Materials Research, Vol. 22(7), pp. 1975-1986.
    122. C.-M. Hsu, *D. S.-H. Wong, and S.-W. Chen, 2007, “A Generalized Phenomenological Model for the Effect of Electromigration on Interfacial Reaction”, Journal of Applied Physics, Vol. 102(2), 023715.
    123. *S.-W. Chen and C.-C. Chen, 2007, "Interfacial Reactions in Sn-0.7wt.%Cu/Ni-V Couples at 250oC”, Journal of Electronic Materials, Vol. 36(9), pp. 1121-1128. (NSC93-2216-E007-043)
    124. Y.-C. Huang, *S.-W. Chen, C.-H. Chang, J.-C. Wu and W. Gierlotka, 2007, “Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders”, Journal of Materials Research, Vol. 22(10), pp. 2924-2929. (NSC95-2221-E-007-205)
    125. C.-F. Yang, *S.-W. Chen, K.-H. Wu and T.-S. Chin, 2007, “Interfacial reactions of Sn-8wt.%Zn-3wt.%Bi solder with Cu, Ni and Ag substrates”, Journal of Electronic Materials, Vol. 36(11), pp. 1524-1530. (NSC95-2218-E-007-028)
    126. W. Gierlotka, *S.-W. Chen and S.-K. Lin, 2007, "Thermodynamic description of the Cu–Sn system", Journal of Materials Research, Vol. 22(11), pp 3158-3165. (NSC95-2221-E-007-205)
    127. C.-H. Wang and *S.-W. Chen, 2007, "Cruciform pattern formation in Sn/Co couples", Journal of Materials Research, Vol. 22(12) , pp 3404-3409. (NSC95-2218-E-007-028)
    128. S.-K. Lin, Y. Yorikado, J. Jiang, K.-S. Kim, *K. Suganuma, *S.-W. Chen, M. Tsujimoto and I. Yanada, 2007, "Microstructure development of mechanical deformation-induced tin whiskers ", Journal of Electronic Materials, Vol. 36(12), pp. 1732-1734.
    129. 2006

    130. C.-H. Wang and *S.-W. Chen, 2006, "Sn-0.7wt%Cu/Ni interfacial reactions at 250oC", Acta Materialia, Vol. 54(1), pp. 247-253. (NSC 93-2216-E-007-043).
    131. C.-Y. Chou and *S.-W. Chen, 2006, "Interfacial reactions and phase equilibria in the Al-Cu/Ta systems", Journal of Electronic Materials, Vol. 35(1), pp. 22-27. (NSC93-2214-E-007-001)
    132. *S.-W. Chen, S.-K. Lin, and C.-F. Yang, 2006, " Interfacial Reactions in the Pb-Free Composite Solders with Indium Layers”, Journal of Electronic Materials, Vol. 35(1), pp. 72-75. (NSC92-2214-E-007-022).
    133. C.-H. Wang and *S.-W. Chen, 2006, "Electric current effects in the flip chip solder joints", Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2), pp. 185-191, (NSC93-2214-E-007-001).
    134. *S.-W. Chen, C.-L. Yang and C.-W. Lin, 2006, “Colorful Dental Archwires”, Journal of the Chinese Institute of Chemical Engineers, Vol. 37(2), pp. 193-194, (NSC-92-2214-E-007-002).
    135. C.-Y. Chou and *S.-W. Chen, 2006, "Phase Equilibria of the Sn-Zn-Cu Ternary System", Acta Materialia, Vol. 54(9), pp. 2393-2400. (NSC93-2214-E-007-001)
    136. *S.-W. Chen and S.-K. Lin, 2006, "Effects of temperature on interfacial reactions in g-InSn4/Ni couples", Journal of Materials Research, Vol. 21(5), pp. 1161-1166. (NSC-94-2214-E-007-006)
    137. C.-C. Chen, *S.-W. Chen and C.-Y. Kao, 2006, "Interfacial reactions in the Sn-(Ag)/(Ni,V) couples and phase equilibria of the Sn-Ni-V system at the Sn-rich corner", Journal of Electronic Materials, Vol. 35(5), pp. 922-928. (NSC93-2216-E007-043)
    138. S.-K. Lin and *S.-W. Chen, 2006, “Interfacial reactions in the Sn-20at%In/Cu and Sn-20at%In/Ni couples at 160oC”, Journal of Materials Research, Vol. 21(7), pp. 1712-1717. (NSC-94-2214-E-007-006)
    139. C.-Y. Chou, *S.-W. Chen and Y.-S. Chang, 2006, "Interfacial Reactions in the Sn-9Zn-(xCu)/Cu and Sn-9Zn-(xCu)/Ni Couples", Journal of Materials Research, Vol. 21(7), pp. 1849-1856. (NSC93-2214-E-007-001)
    140. *S.-W. Chen and C.-H. Wang, 2006, "Interfacial reactions of Sn-Cu/Ni couples at 250°C”, Journal of Materials Research, Vol. 21(9), pp. 2270-2277. (NSC94-2214-E-007-006).
    141. C.-C. Chen and *S.-W. Chen, 2006, "The Sn/Ni-7wt.%V interfacial reactions", Journal of Electronic Materials, Vol. 35(9), pp. 1701-1707. (NSC93-2216-E-007-043)
    142. C.-L. Yang, F.-L. Chen and *S.-W. Chen, 2006, "Anodization of the dental arch wires", Materials Chemistry and Physics, Vol. 100, pp. 268-274. (NSC 93-2214-E-007-001)
    143. *S.-W. Chen, P.-Y. Chen and C.-H. Wang, 2006, "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution”, Journal of Electronic Materials, Vol. 35(11), pp. 1982-1985. (NSC94-2214-E-007-006).
    144. *S.-W. Chen and S.-K. Lin, 2006, "Electric Current-Induced Abnormal Cu/g-InSn4 Interfacial Reactions", Journal of Materials Research, Vol. 21(12), pp. 3065-3071, (NSC 94-2214-E-007-006).
    145. Y.-C. Huang, *S.-W. Chen, C.-H. Chang and C.-C. Wu, 2006, ”Thermal spray processes and heat treatments of thermal sprayed objects” (in Chinese), Chemical Engineering, Vol. 53(3), pp. 69-77. (NSC94-2214-E-007-006).
    146. 2005

    147. C.-A. Chang, *S.-W. Chen, C.-N. Chiu and Y.-C. Huang, 2005, “Primary solidification phases of the Sn-rich Sn-Ag-Cu-Ni quaternary system”, Journal of Electronic Materials, Vol. 34(8), pp. 1135-1142. (NSC92-2214-E-007-002). (Impact factor: 1.457, 2003).
    148. *S.-W. Chen, 2005, "Phase transformation and formations of significant importance", JOM, Vol. 57(9), p. 18. (NSC 93-2216-E-007-043).
    149. C.-N. Chiu, Y.-C. Huang, A.-R. Zi and *S.-W. Chen, 2005, "Isoplethal sections of the liquidus projection and the 250oC phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner", Materials Transactions, Vol. 46(11), pp. 2426-2430. (NSC93-2214-E-007-001) (Impact factor: 1.159, 2003)
    150. *S.-W. Chen, C.-L. Yang, C.-W. Lin and F.-L. Chen, 2005, “Materials for Dental Arch Wires” (in Chinese), Chemical Engineering, Vol. 52(4), pp. 113-118. (NSC 93-2214-E-007-001)
    151. 2004

    152. *S.-W. Chen, S.-K. Lin and J.-M. Jao, 2004, “Electromigration effects upon interfacial reactions in the flip-chip solder joints”, Materials Transactions JIM, Vol. 45(3), pp. 661-665, (NSC91-2214-E-007-013). (Impact factor: 1.159, 2003)
    153. H.-F. Hsu and *S.-W. Chen, 2004, “Phase equilibria of the Sn-Ag-Ni ternary system and interfacial reactions at the Sn-Ag/Ni joints”, Acta Materialia, Vol. 52(9), pp. 2541-2547. (SCI, EI) (NSC91-2214-E-007-013). (Impact factor: 3.059, 2003)
    154. *S.-W. Chen, S.-K. Lin and C.-Y. Chou, 2004, ”Investigation of reactive wetting” (in Chinese), Journal of the Chinese Colloid and Interface Society, Vol. 26(2), pp. 83-88. (NSC92-2214-E-007-002).
    155. *S.-W. Chen, H.-F. Hsu and C.-W. Lin, 2004, “Liquidus projection of the ternary Ag-Sn-Ni alloys”, Journal of Materials Research, Vol. 19(8), pp. 2262-2267. (NSC 91-2214-E-007-013). (Impact factor: 1.635, 2003)
    156. Y.-W. Yen and *S.-W. Chen, 2004, “Phase Equilibria of the Ag-Sn-Cu Ternary System”, Journal of Materials Research, Vol. 19(8), pp. 2298-2305. (NSC89-2214-E-007-006). (Impact factor: 1.635, 2003)
    157. *S.-W. Chen, J.-I Lee and C.-N. Chiu, 2004, “Liquidus projection of the ternary As-Sn-Te system”, Scripta Materialia, Vol. 51(9), pp. 853-856. (NSC91-2214-E-007-013). (Impact factor: 1.633, 2003)
    158. *S.-W. Chen and C.-A. Chang, 2004, “Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the Sn-rich corner”, Journal of Electronic Materials, Vol. 33(10), pp. 1071-1079, (NSC92-2214-E007-002). (Impact factor: 1.457, 2003)
    159. C.-M. Chen, *S.-W. Chen, J.-J. Ko, and H.-P. Pu, 2004, “Effects of Au and Ni layers on the interfacial reactions of the flip chip solder joints" (in Chinese), Journal of the Chinese Colloid and Interface Society, Vol. 26, pp. 119-128.
    160. 2003

    161. H.-Y. Chen, *S.-W. Chen and S.-H. Wu, 2003, "Glass Formation, Physical Properties and Optical Properties of Ge-Se-Sn and Ge-Sb-Se-Sn Alloys", Materials Chemistry and Physics, Vol. 80, pp. 176 – 185. (SCI, EI), (88CS-D-007-010). (Impact factor: 1.183, 2003)
    162. C.-H. Wang, *S.-W. Chen, C.-H. Chang and J.-C. Wu, 2003, "Phase equilibria of the ternary Al-Cu-Ni system and interfacial reactions of related systems at 800oC", Metallurgical and Materials Transactions A, Vol. 34A, pp. 199-209. (SCI, EI), (NSC90-2623-7-007-007). (Impact factor: 1.285, 2003)
    163. *S.-W. Chen and C.-M. Chen, 2003, "Electromigration effects upon interfacial reactions", JOM, Vol. 55(2), pp.62-67. (SCI, EI), (NSC89-2623-7-007-007) (Impact factor: 0.852, 2003)
    164. J.-I Lee, *S.-W. Chen, H.-Y. Chang and C.-M. Chen, 2003, "Reactive wetting between molten Sn-Bi and Ni substrate", Journal of Electronic Materials, Vol. 32 (3), pp. 117-122. (SCI, EI), (NSC89-2623-7-007-007). (Impact factor: 1.457, 2003)
    165. C.-M. Chen and *S.-W. Chen, 2003, "Electromigration effect upon the low-temperature Sn/Ni interfacial reactions", Journal of Materials Research, Vol. 18 (6), pp. 1293-1296. (SCI, EI), (NSC90-2214-E-007-001). (Impact factor: 1.635, 2003)
    166. H.-Y. Chang, *S.-W. Chen, D. S.-H. Wong and H.-F. Hsu, 2003, "Determination of reactive wetting properties of Sn, Sn-Cu, Sn-Ag and Sn-Pb alloys by using a wetting balance technique", Journal of Materials Research, Vol. 18 (6), pp. 1420-1428. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.635, 2003)
    167. C.-H. Wang and *S.-W. Chen, 2003, "Isothermal section of the ternary Sn-Cu-Ni system and interfacial reactions in the Sn-Cu/Ni couples at 800oC", Metallurgical and Materials Transactions A, Vol. 34A, pp. 2281-2287. (SCI, EI), (NSC89-2623-7-007-007). (Impact factor: 1.285, 2003)
    168. *S.-W. Chen, S.-H. Wu and S.-W. Lee, 2003, “Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu and Sn/(Cu,Ni) systems”, Journal of Electronic Materials, Vol. 32(11), pp. 1188-1194. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.457, 2003)
    169. *S.-W. Chen, S.-W. Lee and M.-C. Yip, 2003, “Mechanical Properties and Intermetallic Compound Formation at the Sn/Ni and Sn-0.7wt%Cu/Ni Joints”, Journal of Electronic Materials, Vol. 32(11), pp. 1284-1289. (SCI, EI), (NSC91-2214-E-007-013). (Impact factor: 1.457, 2003)
    170. M.-Y. Du, C.-M. Chen and *S.-W. Chen, 2003, "Effects upon interfacial reactions by electric currents of reversing directions", Materials Chemistry and Physics, Vol. 82(3), pp. 818-825. (SCI, EI), (NSC89-2214-E-007-006). (Impact factor: 1.183, 2003)
    171. 2002

    172. C.-T. Lee and *S.-W. Chen, 2002, "Quantities of Grains and Those of TiB2 and Al3Ti Particles Added in the Grain-Refining Processes", Materials Science and Engineering A, Vol. 325 (1-2), pp. 242-248. (SCI, EI),
    173. C.-Y. Huang and *S.-W. Chen, 2002, "Interfacial reactions in In-Sn/Ni couples and phase equilibria of In-Sn-Ni system", Journal of Electronic Materials, Vol. 31(2), pp. 152-160. (SCI, EI), (NSC89-2214-E-007-006).
    174. S.-J. Luo, C.-H. Wang and *S.-W. Chen, 2002, "Phase Equilibria of the Ternary Ni-Cr-Zr System and Interfacial Reactions in the Ni-Cr/Zr Couples", Metallurgical and Materials Transactions A, Vol. 33A, pp. 995-1002. (SCI, EI), (NSC88-TPC-7-007-006).
    175. C.-M. Chen and *S.-W. Chen, 2002, "Electromigration Effect upon the Sn/Ag and Sn/Ni Interfacial Reactions at Various Temperatures", Acta Materialia, Vol. 50(9), pp. 2461-2469. (SCI, EI), (NSC89-2214-E-007-006).
    176. C.-H. Lin, *S.-W. Chen and C.-H. Wang, 2002, "Phase Equilibria and Solidification Properties of Sn-Cu-Ni Alloys", Journal of Electronic Materials, Vol. 31(9), pp. 907-915. (SCI, EI), (NSC89-2623-7-007-007)
    177. 2001

    178. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 2001, "Properties of As-Te Alloys and Their Interfacial Reactions with Zn Substrate", Materials Chemistry and Physics, Vol. 70(3), pp. 316-325. (SCI, EI),
    179. C.-H. Wang, *S.-W. Chen, C.-H. Chang, and J.-C. Wu, 2001, "Phase Transformations at the Coating-Substrate Interface in Thermal Spraying", Journal of Chinese Foundrymen's Association Quarterly, Vol. 27(1), pp. 12-16.
    180. C.-M. Chen and *S.-W. Chen, 2001, "Electromigration Effect upon the Sn-0.7wt%Cu/Ni and Sn-3.5wt%Ag/Ni Interfacial Reactions", Journal of Applied Physics, Vol. 90(3), pp. 1208-1214. (SCI, EI),
    181. *S.-W. Chen and Y.-W. Yen, 2001, "Interfacial Reactions in the Sn-Ag/Au Couples", Journal of Electronic Materials, Vol. 30(9), pp. 1133-1137. (SCI, EI),
    182. 2000

    183. Y.-W. Yen and *S.-W. Chen, 2000, "Ni and Cu Deposition on Fine Alumina Particles by using the Chemical Vapor Deposition-Circulation Fluidized Bed Reactor", Journal of Materials Science, Vol. 35, pp. 1439-1444. (SCI, EI), (NSC85-2214-E-007-023).
    184. *S.-W. Chen and S.-J. Luo, 2000, "Interfacial Reactions in Pt/Ti, Pt/Zr, Pt/TiO2 and Pt/ZrO2 Couples", Industrial & Engineering Chemistry Research, Vol. 39(2), pp. 547-549. (NSC87-CPC-E-007-010). (SCI, EI),
    185. *S.-W. Chen, C.-S. Ho, C.-H. Lin, and C.-M. Chen, 2000, "The 900oC Isothermal Section of Ti-Ni-V Alloys", Metallurgical and Materials Transactions A, Vol. 31A, pp. 1679-1682. (NSC88-2216-E-007-039). (SCI, EI),
    186. C.-M. Chen and *S.-W. Chen, 2000, "Electromigration effect upon the Zn/Ni and Bi/Ni interfacial reactions", Journal of Electronic Materials, Vol. 29(10), pp. 1222-1228. (SCI, EI), (NSC89-2214-E-007-006).
    187. 1999

    188. C.-M. Chen and *S.-W. Chen, 1999, “Electric Current Effects Upon the Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906. (SCI,EI), (NSC87-2214-E-007-021).
    189. Y.-M. Dai, *S.-W. Chen, C.-H. Chen and J.-L. Wang, 1999, “Glass Formation, Density, Microhardness, and Optical Properties of As-Si-Te Chalcogenide Alloys”, Journal of Non-Crystalline Solids, Vol. 255, pp. 217-227. (SCI, EI),
    190. *S.-W. Chen and Y.-W. Yen, 1999, “Interfacial Reactions in the Ag-Sn/Cu Couples”, Journal of Electronic Materials, Vol. 28(11), pp. 1202-1207. (SCI, EI), (NSC87-2214-E-007-021).
    191. C.-H. Chen, *S.-W. Chen, and J.-L. Wang, 1999, "Interfacial Reactions in As-Te/Zn and As-Si-Te/Zn Systems", Chinese Journal of Materials Science, Vol. 31(3), pp. 160-165.
    192. 1998

    193. W.-C. Liu, *S.-W. Chen and C.-M. Chen, 1998, "The Al\Ni Interfacial Reactions Under the Influence of Electric Current", Journal of Electronic Materials, Vol. 27(1), L5-L8. (NSC86-2745-E-007-005R).
    194. B.-R. Shie, *S.-W. Chen, and J.-L. Wang, 1998, "Interfacial Stability of the As-Se-S/ZnS, As-Se-S/ZnSe, As-Se-Tl/ZnS, As-Se-Tl/ZnSe and Related Systems", Journal of Non-Crystalline Solids, Vol. 231, pp.240-250.
    195. *S.-W. Chen, C.-C. Lin, and C.-M. Chen, 1998, "Determination of the Melting and Solidification Characteristics of Solders by Using DSC", Metallurgical and Materials Transactions A, Vol. 29A, pp. 1965-1972. (NSC87-2214-E-007-021).
    196. *S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198. (NSC87-2214-E-007-021).
    197. 1997

    198. *S.-W. Chen and S.-C. Jeng, 1997, “Determination of the Solidification Curves of a Rene N4 Superalloy”, Metallurgical and Materials Transactions A, Vol. 28A, pp. 503-504. (NSC 85-2216-E007-042)
    199. C.-C. Chen and *S.-W. Chen, 1997, “Nickel and Copper Deposition on Al2O3 and SiC Particulates by Using the Chemical Vapor Deposition-Fluidized Bed Reactor Technique”, Journal of Materials Science, Vol. 32, pp. 4429-4435. (NSC-84-2214-E-007-019)
    200. S.-C. Jeng and *S.-W. Chen, 1997, "The Solidification Characteristics of the 6061 and A356 Aluminum Alloys and Their Ceramic Particle-Reinforced Composites", Acta Materialia, Vol. 45(12), pp. 4887-4899. (NSC85-2216-E-007-042)
    201. L.-H. Su, Y.-W. Yen and *S.-W. Chen, 1997, “Interfacial Reactions in the Molten Sn/Cu and Molten In/Cu Couples”, Metallurgical and Materials Transactions B, Vol. 28B, pp. 927-934. (NSC 83-0115-C007-01-006E and NSC 86-2745-E-007-005R).
    202. *S.-W. Chen, M.-H. Lin, B.-R. Shie, and J.-L. Wang, 1997, “Interfacial reactions in As-Se/Zn”, Journal of Non-Crystalline Solids, Vol. 220, pp. 243-248. (NSC 85-2815-C007-01-028E).
    203. S.-D. Ho, Y.-M. Dai, *S.-W. Chen, and J.-L. Wang, 1997, "Microstructure, Density and Microhardness of the As-Se-Tl Chalcogenide Glass", Journal of Non-Crystalline Solids, Vol. 221, pp. 290-296, 1997.
    204. 1996

    205. *S.-W. Chen and C.-C. Huang, 1996, "Solidification Curves of Al-Cu, Al-Mg, and Al-Cu-Mg Alloys", Acta Materialia, Vol. 44(5), pp. 1955-1965. (NSC 83-0405-E-007-007)
    206. *S.-W. Chen and S.-C. Jeng, 1996, "Determination of the Solidification Curves of Commercial Aluminum Alloys", Metallurgical and Materials Transactions A, Vol. 27A, pp. 2722-2726. (NSC 84-2216-E-007-027)
    207. H.-T. Luo and *S.-W. Chen, 1996, "Phase Equilibria of the Ternary Ag-Cu-Ni System and the Interfacial Reactions in the Ag-Cu/Ni Couples", J. Materials Science, Vol. 31(19), pp. 5059-5067. (NSC 82-0405-E-007-285)
    208. 1995

    209. *R.-F. Kuo, J.-J. Wu, W.-H. Lo, Y.-C. Tsui, H.-M. Chen and S.-W. Chen, 1995, "The effect of hole size on the spiral fracture of cortical bone in a tubular torsional model", Chinese Journal of Medical and Biological Engineering, Vol. 15(3), pp. 179-187.
    210. *S.-W. Chen, C.-C. Huang and J.-C. Lin, 1995, "The Relationship between the Peak Shape of a DTA Curve and the Shape of a Phase Diagram", Chemical Engineering Science, Vol. 50(3), pp. 417-431. (NSC 82-0405-E-007-130)
    211. C.-C. Huang and *S.-W. Chen, 1995, "Phase Equilibria of Al-rich Al-Cu-Mg Alloys", Metallurgical and Materials Transactions A, Vol. 26A, pp. 1007-1011. (NSC 83-0405-E-007-007)
    212. C.-L. Tsao and *S.-W. Chen, 1995, "Interfacial Reactions in the Liquid Diffusion Couples of Mg/Ni, Al/Ni, and Al/(Ni)-Al2O3 Systems", Journal of Materials Science, Vol. 30, pp. 5215-5222. (NSC 83-0402-E-007-018)
    213. C.-C. Chen and *S.-W. Chen, 1995, "Surface Treatment of Particles by Using Fluidized Bed Technology", Journal of the Chinese Institute of Chemical Engineers, Vol. 26(5), pp. 263-267. (NSC 83-0402-E-007-018)
    214. 1993

    215. A. Bolcavage, S.-W. Chen, C.R. Kao, *Y.A. Chang, and A. D. Roming, Jr., 1993, "Phase Equilibria of the Cu-In System, I:Experimental Investigation", J. of Phase Equilibria, Vol. 14(1), pp. 14-21.
    216. C.R. Kao, A. Bolcavage, S.-L. Chen, S.-W. Chen, *Y.A. Chang, and A. D. Roming, Jr., 1993, "Phase Equilibria of the Cu-In System ,II:Thermodynamic Assessment and Calculation of Phase Diagram", J. of Phase Equilibria, Vol. 14(1), pp. 22-30.
    217. *S.-W. Chen, 1993, "Interfacial Reactions in the Liquid (Ag,Cu)/Ni Diffusion Couples", Materials Chemistry and Physics, Vol. 33, pp. 271-276.
    218. Before 1992

    219. S.-W. Chen and *Y. A. Chang, 1992, "Microsegregation in Solidification of Ternary Alloys", Metallurgical Transactions A, Vol. 23A, pp. 1038-1043.
    220. S.-W. Chen, H.W. Beumler and *Y.A. Chang, 1991, "Experimental Determination of the Phase Equilibria of Aluminum-Rich Al-Li-Cu Alloys", Metallurgical Transactions A, Vol. 22A, 203-213.
    221. S.-W. Chen and *Y. A. Chang, 1991, "Application of Thermodynamic Models to the Calculation of Solidification Paths of Al-rich Al-Li Alloys", Metallurgical Transactions A, Vol. 22A, pp. 267-271.
    222. S.-W. Chen, Y.Y. Chuang, *Y.A Chang and M.G. Chu, 1991, "Calculation of Phase Diagrams and Solidification Paths of Al-rich Al-Li-Cu Alloys", Metallurgical Transactions A, Vol. 22A, pp. 2837-2848.
    223. S.-W. Chen, C.-H. Jan, J.-C. Lin and *Y.A. Chang, 1989, "Phase Equilibria of the Al-Li Binary System", Metallurgical Transactions A, Vol. 20A, pp, 2247-2258.
      (* corresponding author)