學術活動
國內專業學會事務 (Activities in domestic professional societies)
- 理事長: 台灣化學工程學會, 2018/12~2020/12
- 副理事長: 中國材料學會, 2018/2~2021/1
- (理)監事: 中國工程師學會新竹分會, 2010~迄今
- (常務)理事:中國材料學會, 2009~迄今
- 學術委員:中國材料學會學術委員會, 2009~2014
- 主任委員:台灣化學工程學會國際關係委員會, 2011/2~2011/8
- 常務理事:台灣化學工程學會, 2005, 2007~2010
- 理事:台灣化學工程學會, 2004~2010
- 評選委員: 十大傑出工程師, 中國工程師學會, 2007~2010
- 主任委員:學術委員會, 中國化學工程學會, 2003/2~ 2005/12
- 主任委員:會刊及叢書委員會, 中國化學工程學會, 2003 /2~ 2005/12
- 評選委員:優秀青年工程師, 中國工程師學會, 1999~2002
- 副秘書長:中國材料學會, 1999~2002
國際專業學會與國外大學事務
(Activities in the international professional societies and foreign universities)
- Committee Member:Alloy Phase Diagram Committee, ASM, 2006/8~now
- Council Member:EMPMD, TMS, 2004/3~now
- Chairperson:Alloy Phase Committee, TMS, 2004/3~ 2006/2; 2014/3~now
- Advisor:JOM, TMS, 2004/3~2008/3
- Chairperson:The GRE Asia Advisory Council, 2013
- External Expert:EU COST Action MP0602, "Advanced Solder Materials for High Temperature Application", Brno, Czek, June 2011
- Visiting Professor:(Lecturer of the Phase Equilibria of Materials course): Materials Science and Engineering Department, University of Wisconsin-Madison, Madison, WI, USA, 2007/8~ 2007/12
- Invited Professor:Laboratoire Genie des materiaux, Ecole Polytechnique de l'universite de Nantes, Nantes, France, 2002/6~ 2002/7
- Visiting Scholar:Materials Science and Engineering Department, Lehigh University, Bethlehem, PA, USA, 2000/6~ 2000/8
編輯任務(Editorial duties)
- Editorial committee member:Journal of Phase Equilibria and Diffusion, 2010/1~now
- Associate editor:Journal of Electronic Materials, 2006/8 ~now
- Editorial board member:Advances in Materials Research [ISSN: 2234-0912(Print), ISSN: 2234-179X(Online)], 2012/1~ 2014/12
- Editorial board member:Progress in Natural Science: Materials International, 2011/1~ 2014/12
- Editorial committee member:Journal of Engineering (National Chung Hsing University), 2010/1~2014/12
- Editorial board member:Nanoscience and Nanotechnology Letters, 2009/3~ 2011/12
- Editorial board member (編輯委員) :化工(Chemical Engineering), 台灣化學工程學會, 2006/2~2011/1.
- Guest editor:Journal of Electronic Materials, 2003/11, 2006/1, 2006/11, 2007/11
- Editor-in-Chief (總編輯) :化工(Chemical Engineering), 中國化學工程學會, 2003/2~ 2006/1
- Regional editor:Facets, IUMRS, 2000/11~2006/12
- Guest editor (主編):材料會訊(Materials Science Bulletin), 中國材料科學學會, 1999/6
- Guest editor (主編):電子資訊(Electronics Spectrum), EDMA and SID, 1996/9
國際邀請演講(International invited talks)
- "相圖與電子軟銲及熱電- 兼談台灣高等教育", 蘭州大學,蘭州、中國,August 18, 2017 (Invited Lecture).
- "相圖計算、缺陷模型與熱電性質", 發表於「第十屆海峽兩岸化學工程學術研討會」,銀川,中國。(Invited speech)
- "Phase equilibria studies of thermoelectric materials", presented at the 2017 APAM Sendai International Conference, Sendai, Japan. (Invited speech)
- “Interfacial reactions at the joints in the Bi2Te3-based thermoelectric modules“ (Invited speech), presented at the 146th TMS annual meeting, San Diego, USA. (Invited speech)
- S.-W. Chen, J.-C. Wang and L.-C. Chen, 2017, “Interfacial reactions at the joints of PbTe thermoelectric modules“, presented at the 146th TMS annual meeting, San Diego, USA. (Invited speech)
- "Phase diagrams and applications: Electronic soldering and Thermoelectrics", University of Illinois- Urbana Champaign, Urbana, Illinois, USA, 2016 (Invited Lecture).
- "相圖與電子軟銲及熱電- 兼談台灣高等教育", 西安交通大學,西安、中國,April 9, 2016 (Invited Lecture).
- "相圖與電子軟銲及熱電- 兼談台灣高等教育", 西北工業大學,西安、中國,April 5, 2016 (Invited Lecture).
- "相圖與電子軟銲及熱電- 兼談台灣高等教育", 山東大學,濟南、中國,April 1, 2016 (Invited Lecture).
- "Interfacial Reactions in the Ni/Ag-Sb and Ni/Ag-Ge Couples", presented at the 145th TMS annual meeting, Nashiville, Tennessee, USA, Februay 2016, (Inivted speech).
- "Interfacial Reactions in Thermoelectric Devices", Presented at the 144th TMS 2015 annual meeting, Orlando, Florida, USA, March 2015 (Invited speech).
- "Phase Equilibria of Cu-In-Se Ternary System ", Presented at the 144th TMS 2015 annual meeting, Orlando, Florida, USA, March 2015 (Invited speech).
- "Phase diagrams of thermoelectric Co-Sb-In ternary system", Presented at the 2014 IUMRS-ICEM, Taipei, Taiwan, June 2014 (Invited speech).
- "Phase equilibria of thermoelectric materials: Ag-Sb-Te and AgSbTe2-AgSbSe2", Presented at CALPHD XLIII meeting, Chang Sha, China, June 2014 (Invited speech)
- "CoSb3-InSb Isoplethal Section of Co-Sb-In Ternary Phase Diagram", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
- "Interfacial Reactions of Sn with the n-Type Bi2(Te,Se)3 and p-Type (Bi,Sb)2Te3 Thermoelectric Materials", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
- "Ag Whisker Growth of Ag-In-Se Alloys and Alternating Layer Formation in the In/Ag2Se Reaction Couples", Presented at the 143rd TMS 2014 annual meeting, San Diego, CA, USA, March, 2014. (Invited speech)
- "Electronic soldering and thermoelectric materials: Phase diagrams and microstructures", Presented at the COST-Materials in a resource-constrained world conference, Deft University, November 19, 2013. (Invited speech)
- "相圖在電子軟銲上之應用", Presented at the 「海峽兩岸先進半導體封裝材料發展趨勢研討會」, 廈門、中國,June 14, 2013. (Invited Lecture)
- "相圖與應用:熱電與電子軟銲", Presented at the 「海峽兩岸三地新材料高端論壇」, 天津、中國,June 17, 2013. (Invited Lecture)
- "Reaction evolution and alternating layer formation in Sn/(Bi1-xSbx)2Te3 couples", Presented at the the 142nd TMS annual meeting, San Antonio, TX, USA, March, 2013. (Invited speech)
- "Interfacial reactions in the Sn-20wt%In-xwt%(Ag, or Zn)/(Cu, or Ni) couples", Presented at the Visual-JW 2012 (The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation) meeting, Osaka, Japan, November, 2012. (Keynote Speech)
- "Phase diagrams and applications: in electronic soldering and thermoelectric materials", UCLA, Los Angeles, USA, 2012.
- "Phase diagrams and applications: in electronic soldering and thermoelectric materials", Univesity of Michigan, Ann Arbor, USA, 2012.
- "Directional solidification and liquidus projection of Sn-Co-Cu system", Presented at the 141st TMS annual meeting, Orlando, FL, USA, March, 2012. (Invited speeh)
- "CALPHAD method and its application to lead-free solder materials", Presented at the 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei, September 2011. (Invited speeh)
- "Isothermal section and liquidus projection of the Sn-Zn-Ni ternary system", Presented at the 12th Annual Meeting of International Union of Materials Research Societies (IUMRS) - International Conference in Asia (ICA), Taipei, September 2011. (Invited speeh)
- "Electromigration effects upon electronic solder joints", Harbin Institute of Technology, Harbin, China, 2011.
- "Electromigration effects upon electronic solder joints", Xiangtan University, Xiangtan, China, 2011.
- "Phase diagrams and their applications in electronic solder joints", Central South University, Changsha, China, 2011.
- "Interfacial reactions in the Sn-(Pb)/Ni-7wt%V couples", Presented at the 140th TMS annual meeting, San Diego, CA, USA, October 2010. (Invited speeh)
- "Sn-In-Ag phase equilibria and Sn-In/Ag Interfacial reactions", Presented at the Materials Science and Technology 2010 Meeting, Pittsburgh, PA, USA, October 2010. (Invited speeh)
- "Unusual Phenomena Observed in Soldering: Understanding Through Thermodynamics", Presented at the Materials Science and Technology 2010 Meeting, Pittsburgh, PA, USA, October 2010. (Invited speeh)
- “Interfacial reactions in the Sn-Co/Ni and Sn-Co-Cu/Ni couples", Presented at the 139th TMS annual meeting, SeattleWA, USA, February 2010. (Invited speeh)
- "Phase diagrams and their applications in electronic soldering", Presented at the Japan-Taiwan Joint Symposium on New Functional Materials and Their Nano- scale Analysis, Kyoto University, Kyoto, Japan, November 2009. (Invited speeh)
- "Interfacial reactions in the Solder/Ni-7wt%V alloy couples", Presented at the Materials Science and Technology 2009 Meeting, Pittsburgh, PA, USA, 2009. (Invited speeh)
- "Phase diagrams and their applications in electronic packaging", Department of Materials Science and Engineering, Tsinghua University, Beijing, China, 2009.
- “Interesting Phenomena Observed in The Sn/Co Interfacial Reactions”, Presented at the 138th TMS Annual Meeting, San Francisco, CA, USA, 2009. (Invited speeh)
- "Solidification of Sn-Bi-Ag and Sn-Bi-Ni alloys", Presented at the Materials Science and Technology 2008 Meeting, Pittsburgh, PA, USA, 2008. (Invited speeh)
- "Sn/Co Interfacial Reactions", Presented at the 137th TMS Annual Meeting, New Orleans, LA, USA, 2008. (Invited speeh)
- "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Rensselaer Polytechnic Institute, Troy, NY, USA, 2007.
- "Determinations of solidification curves of aluminum alloys - and some other things I learned from Alcoa", Alcoa Research Center, Alcoa center, PA, USA, 2007.
- "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Pennsylvania State University, University Park, PA, 2007.
- "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, Michigan State University, East Lansing, MI, USA, 2007.
- "Electronic soldering-Pb-free solders and Interfacial reactions", ThermoFisher Scientific, Brookfield, WI, USA, 2007.
- "Some interesting phenomena observed in the soldering systems", Department of Materials Science and Engineering, University of Wisconsin-Madison, Madison, WI, 2007.
- “Interfacial Reactions and Phase diagrams of Pb-Free Solders and Related Materials Systems,” presented at the Symposium on Phase Stability and Defect Structures in Advanced Materials: in honoring Professor Austin Chang, Distinguished Professor at University of Wisconsin, Crown Plaza Orlando Resort, Orlando, FL, USA, 2007. (Invited speeh)
- “Unusual interfacial reactions in the Sn/Ni-7wt.%V and Sn/Te couples”, Presented at the 136th TMS Annual Meeting,Orlando, FL, USA, 2007. (Invited speeh)
- "Electric Current Effects upon Interfacial Reactions in the Solder Joints", Department of Materials Science and Engineering, Beijing University of Technology, Beijing, China, 2006.
- "Electromigration effects upon interfacial reactions in teh Pb-free solder joints", Presented at the 2006 International Conference on Chemical and Molecular Technologies, Tainan, Taiwan, 2006. (Invited speeh)
- "Melting point lowering of the Sn-Sb alloys caused by substrate dissolution", Presented at the 135th TMS Annual Meeting, San Antonio, TX, USA, 2006. (Invited speeh)
- "Phase Equilibria of the In-Sn-Cu System and the In-Sn/Cu Interfacial Reactions", Presented at Materials Science and Technology 2005 Meeting, Pittsburgh, PA, USA, 2005. (Invited speeh)
- "Phase equilibria and interfacial reactions of Pb-free solders/UBM systems", Department of Materials Science and Engineering, KAIST, Daejeon, Korea, 2005.
- "Electric current effects upon interfacial reactions in the solder joints", Presented at the SEMICON Korea 2005, Seoul, Korea, 2005.(Invited speeh)
- "Phase equilibria and interfacial reactions in the indium composite solder related materials systems", School of Materials Science and Engineering, Seoul National University, Seoul, Korea, 2005.
- "Electric current effects upon interfacial reactions in the solder joints", Samsung Electronics, Gyeonggi-Do, Korea, 2005.
- “Solidification of the quaternary Sn-Ag-Cu-Ni alloys”, Presented at the Materials Science and Technology 2004 Meeting, New Orleans, LA, USA, 2004. (Invited speeh)
- “Electromigration effects upon the Pb-free solder/Nickel interfacial reactions in the electronic products”, Presented at the Second 21stCentury COE, “Towards Creating New Industries Based on Inter-Nanoscience”, and 7th Sanken International Symposium on Hybridization of Chemistry, Biology and Materials Science, Osaka, Japan, 2004. (Invited speeh)
- ”Relationship between mechanical properties and intermetallic compound formation at the Sn-0.7(0.5, 0.3, 0.1)wt%Cu/Ni joints”, Presented at the 132nd TMS Annual Meeting, San Diego, CA, USA, 2003. (Invited speeh)
- “Phase equilibria and solidification properties of Sn-Cu-Ni alloys”, Presented at the 131st TMS Annual Meeting, Seattle, WA, USA, 2002.(Invited speeh)
- “Phase transformations and interfacial reactions in electronic materials”, Presented at the 2001 ChemTech Conference, Chicago, IL, USA, 2001. (Invited speeh)
- “Interfacial reactions in the Ag-Sn/Au couples”, Presented at the 130th TMS Annual Meeting, New Orleans, LA, USA, 2001. (Invited speeh)
- “Interfacial Reactions in the Ag-Sn/Cu Couples”, Presented at the 128th TMS Annual Meeting, San Diego, CA, USA, 1999. (Invited speeh)
- "Determination of Solidification Curves of Alloys", Presented at the Australasia Pacific Forum on Intelligent Processing & Manufacturing of Materials, Brisbane, Australia, 1997. (Invited speeh)
國際學術會議議程籌委與議程主席
(Symposium organizer and session chair of international meetings)
- Session Chair: 131st TMS Annual Meeting~ 146rd TMS Annual Meeting (2002~2017); Materials Science and Technology Meeting (2010, 2008, 2005, 2004), 2001 TMS Fall Meeting, 2001 (2001); "Materials Modeling, Simulation, and Characterizations symposium", 12th Annual Meeting of International Union of Materials Research Societies (IUMRS)- International Conference in Asia (ICA), Taipei, 2012; Visual-JW 2012, Osaka, Japan, November, 2012.
- Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium V”, The Minerals, Metals & Materials Society 2017 Annual Meeting, San Diego, CA, 2017.
- Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium IV”, The Minerals, Metals & Materials Society 2016 Annual Meeting, Nashville, Tenn., 2016.
- Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium III”, The Minerals, Metals & Materials Society 2015 Annual Meeting, Orlando, FL, 2015.
- Symposium Organizer: “Group E: Modeling, Processing and Characterization”, International Union of Materials Research Societies – International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan, 2014.
- Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium II”, The Minerals, Metals & Materials Society 2014 Annual Meeting, San Diego, CA, 2014.
- Symposium Organizer: “Alloys and Compounds for Thermoelectric and Solar Cell Application Symposium”, The Minerals, Metals & Materials Society 2013 Annual Meeting, San Antonio, TX, 2013.
- Advisory Committee Member: Visual-JW 2012 (The International Symposium on Visualization in Joining & Welding Science through Advanced Measurements and Simulation) meeting, Osaka, Japan, November, 2012.
- Symposium Organizer: "Materials Modeling, Simulation, and Characterizations symposium", 12th Annual Meeting of International Union of Materials Research Societies (IUMRS)- International Conference in Asia (ICA) , Taipei, 2012.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials X Symposium”, The Minerals, Metals & Materials Society 2011 Annual Meeting , San Diego, CA, 2011.
- Symposium Organizer: “Lead-free Solders and Next Generation Interconnects: Emerging Issues in Manufacturing”, Materials Science and Technology 2010 Meeting , Houston, TX, 2010.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium”,The Minerals, Metals & Materials Society 2010 Annual Meeting, Seattle, WA, 2010.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VIII Symposium”, The Minerals, Metals & Materials Society 2009 Annual Meeting , San Francisco, CA, 2009.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VII Symposium”, The Minerals, Metals & Materials Society 2008 Annual Meeting , New Orleans, LA, 2008.
- Symposium Organizer: “Hume-Rothery Symposium”, The Minerals, Metals & Materials Society 2008 Annual Meeting , New Orleans, LA, 2008.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials VI Symposium”, The Minerals, Metals & Materials Society 2007 Annual Meeting , Orlando, FL, 2007.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials V Symposium”, The Minerals, Metals & Materials Society 2006 Annual Meeting, San Antonio, TX, 2006.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials IV Symposium”, The Minerals, Metals & Materials Society 2005 Annual Meeting , San Francisco, CA, 2005.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials III Symposium”, The Minerals, Metals & Materials Society 2004 Annual Meeting , Charlotte, NC, 2004.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium”, The Minerals, Metals & Materials Society 2003 Annual Meeting , San Diego, CA, 2003.
- Symposium Organizer: “Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials Symposium”, The Minerals, Metals & Materials Society 2002 Annual Meeting , Seattle, WA, 2002.
- Symposium Organizer: “Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for Electronic Packaging Symposium”, The Minerals, Metals & Materials Society 2001 Fall Meeting , Indianapolis, IN, 2001.